Products

SIPAD VIP

SIPAD VIP is via in pad technology. SIPAD Systems has developed different solutions for filling via holes with solder. Size, design and other factors affect which process is used. Please contact SIPAD Systems for more information on SIPAD VIP

SIPAD VIP Method 1 - Over-compensating Single Print Method

Via holes in bottom 9 holes of the BGA. Holes are .014 in diameter.
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Stencil is compensated adding more paste on VIP areas.
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These VUIP pads are compensated +20%
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Vias drain some paste from the surface of the ssd.
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Finished SIPAD ssd exhibit some draining but very little voiding.
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SIPAD VIP Method 2 - 2 Print VIP Areas

Solder is applied only to the VIP areas.
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Paste drains into VIP's.
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Entire board including the BGA is printed applying a second load on the VIP areas.
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VIP pads are now full and ready for flattening.
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Finished SIPAD VIP's are perfect.
(9 pads, top left corner)
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Finished SIPAD VIP's are perfect. (9 pads, top left corner)
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X-rays confirm the filled SIPAD VIP areas.
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Via holes full of solder under the SIPAD ssd.
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Minimal voiding. Nothing over 5%.
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Make sure to check out the SIPAD Soldermask Requirements to learn more about the design and application of SIPAD boards.