Products

SIPAD

The SIPAD process is offered in a few different varieties. Regular SIPAD ssd is eutectic 63/37 tin lead solder deposits. This is the original version and can use any eutectic solder paste as long as it is a water soluble version. SIPAD boards must be washed before flattening. Tin/Silver/Lead blends are also available for harsher environments but must be special ordered.

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First, solder paste is applied into the wells using a normal stencil printing operation.

Next, the solder paste is fused in a standard reflow oven without the components. During this initial reflow the solder paste fuses into a meniscus above the plane of the solder mask. At this point the boards are thoroughly washed to remove any solder balls or residue.

After washing, the boards are placed into a flattening system, which heats the solder deposit to the melting point and flattens the pads between the platens of a cold press. This process "freezes" the solder deposits into a planar surface.

Once the SIPAD board is flattened, the same stencil is used to apply adhesive no clean flux to the surface mount pads. This flux was developed especially for SIPAD and is the only product available that is designed to be applied and dried to a tacky finish, then protected by a release paper to maintain the tack. This flux holds the components in place and burns off during the final reflow leaving no noticeable residue.

During the final reflow, the SIPAD returns to the original rounded shape, attaching the component in the process. No opens, shorts or cleaning, and less voiding than traditional paste and place.

Make sure to check out the SIPAD Soldermask Requirements to learn more about the design and application of SIPAD boards.