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Video

View Movie - SIPAD solid solder deposit reflow using a convection toaster oven. Reflow begins in top left corner and works towards the BGA. Total time approximately 5 minutes.

Data Sheets

SP37 Data Sheet
SP37 Safety Data Sheet
SIPAD Adhesive Flux MSDS Information

CAD Files Needed to Build Sample Boards

ALL CAD FILES below in Zip Format

Individual Files
drillmk.pho 630KB
primarymk.pho 146KB
psmaskmkmodified.pho 46KB
secondarymk.pho 61KB
sipadsolslk2.gbr 55KB
ssmaskmk.pho 17KB

Misc Technical Papers

NASA report on double SIPAD process used on boards for the ISS (International Space Station) 787KB
Customer sponsored study showing SIPAD ssd assembly process. 1.2MB
2001 SMTA International Paper presented in Chicago written by Matt Kehoe. 1MB
Hand placing leadless and fine pitch components with SIPAD Solid Solder Deposit. 376KB
SIPAD BGA evaluation produced by Tessera. 450KB

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